Semiconductor Bonding Market (2022-2030) Global Trend Analysis, New Strategies Marketing Plan Based on Dynamics, Opportunities, Drivers/Restraints and Forecast
The increasing use of stacked chip technology in IoT devices is propelling the semiconductor bonding market forward.
Newark, May 11, 2022 (GLOBE NEWSWIRE) — According to report published by The Brainy Insights, the global semiconductor bonding market is expected to grow from $874 million in 2021 to $1,222.6 million by 2030, with a CAGR of 3.8% over the forecast period 2022-2030.
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Semiconductors are the components that have transmission between transmission lines (usually metals) and non-conductors or insulators (like ceramics). Semiconductors can either be molecules like gallium arsenide or pure aspects like silicon. The assumptions, characteristics and arithmetic approach that dictate semiconductors are explained in physics. The charged particles of this shell of electronegativity are those which establish relations with neighboring atoms. Covalent bonds are the name given to these bonds. In the valence shell of most conductors, there is only one electron. In contrast, semiconductors usually have four electrons in the outermost shell. However, if the number of electrons of nearby atoms is the same, the electrons can bond with the valence electrons of other particles. Atoms organize themselves into crystal structures whenever this happens.
Stacked chip technologies are rapidly being used in IoT devices. This factor propels the semiconductor bonding market forward. The majority of the Internet of Things (IoT) domain requires functionality similar to the tightly packed array method. The configuration matrix reduces the overall size of the finished part. One of the main reasons for the increasing use of patterned array methodology is a portable electronic device. As a result, an increase in the demand for semiconductor bonding solutions is driving the growing use of stacked chip advancement in IoT devices.
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The major players operating in the global semiconductor bonding market are BE Semiconductor Industries NV, ASM Pacific Technology Ltd., Panasonic, Fuji Corporation, Kulicke & Soffa, Yamaha Motor Robotics Corporation Co., Shiaura Mechatronics, SUSS MicroTech SE, among others. To strengthen their position in the global semiconductor bonding market, the major players are now focusing on adopting strategies such as product innovations, mergers and acquisitions, recent developments, joint ventures, collaborations and partnerships.
• In April 2021, ASM Pacific Technology introduced three new production processes utilizing X-Micro Celeprint transfer publishing and ASM AMICRA’s reproducibility matrix bonding technology to enable diverse incorporation of significant matrix intensity ultra-thin down to 300 mm base plate.
• For example, GlobalWafers Co., Ltd. invested NTD 10 billion (USD 339 million) in its branch in Taisil (Taiwan) in June 2020 to increase the capacities of 300mm silicon wafers. It is estimated that the increased capacity will meet the growing demand for high quality silicon wafers. Such growth in the country is increasing the demand for wafer bonding devices.
• ASM Pacific Technology collaborated with EV Group (Austria) in January 2021 to facilitate ultra-precise hybrid chip-to-wafer bonding solutions for diverse 3D-IC assimilation.
• Palomar Technologies launched in September 2020 its new fully automated operating and operating high-speed wire welder, combining state-of-the-art innovation.
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Wafer bonder segments dominated the market with a market share of around 41.2% in 2021.
The type segment is divided into wafer bonder, flip chip bonder and die bonder. The wafer bonder segment dominated the market with a market share of approximately 41.2% in 2021. A wafer bonder requires gathering the preferred materials in a controlled manner and implementing a mixture of force or pressure, to high temperature, or existing as required by gluing. method. A wafer glue can generally be considered acceptable to maintain the correct orientation between the two surfaces to be bonded. As a result, the wafer bonder is a complicated system requiring high levels of precision and control.
The LED segment led the market with a market share of 29.33% in 2021.
The Application segment is divided into CMOS Image Sensors, RF Devices, LEDs, 3D NAND, MEMS and Sensors. The LED segment dominates the market with a market share of 29.33% in 2021. LED is a PN junction diode that lights up when electricity passes through it. Recombination of charge carriers occurs in the LED. When an electron on the N side and a hole on the P side combine, they generate energy in the form of light and heat. The LED is made of a colorless semiconductor material and light is emitted through the intersection of the diode.
The die bonding technology segment led the market, accounting for approximately 64.2% market share in 2021.
The technology segment is divided into chip bonding technology (flip-chip bonding, epoxy chip bonding, hybrid bonding and eutectic chip bonding), wafer bonding technology (tcb wafer bonding, direct wafer bonding, hybrid bonding and bonding of anodic plates). Chip bonding can be defined as the placement of semiconductor material on the next level of connections, whether in substance or on board. This is called die placement, die to connect or die linking in the industry. Even though the objective is the same, the die-gluing procedures and the material differ greatly, depending on the characteristics and functions, the expenses, the achievements, the volume, the past or the existing, the standard of living of the product and the necessary durability.
Regional Segment Analysis of Semiconductor Bonding Market
• North America (United States, Canada, Mexico)
• Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
• Asia-Pacific (China, Japan, India, rest of Asia-Pacific)
• South America (Brazil and rest of South America)
• The Middle East and Africa (UAE, South Africa, Rest of the Middle East and Africa)
Among all regions, Asia-Pacific has emerged as the largest market for the global semiconductor bonding market, with a market share of around 38.5% in 2021. The growing number of IDMs in the region is expected to drive the growth of the semiconductor bonding market shortly. . Likewise, mass manufacturing of electronic devices such as mobile phones, smart watches, and home appliances in China and Taiwan is expected to drive the growth of the Asia-Pacific market.
About the report:
The global semiconductor bonding market is analyzed on the basis of value (USD million). All segments were analyzed globally, regionally and nationally. The study includes analysis of more than 30 countries for each coin. The report offers an in-depth analysis of the drivers, opportunities, restraints and challenges to gain a critical overview of the market. The study includes Porter’s five forces model, attractiveness analysis, raw material analysis, supply, demand analysis, competitor position analysis, distribution and marketing channel analysis.
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